Huawei Kirin 9000S (el. microscope forensic)
The chip is technically incredible. The performance and power consumption profile in a variety of tests bring it on par with 1 to 2-year-old Qualcomm chips (S888 & S8G1). The RF side of the chip is amazing, using an integrated modem that is on par with Qualcomm’s current best.
The most shocking finding is that when direct comparisons are done on identical IP, the Arm A510 for Huawei’s Kirin 9000S built on SMIC’s N+2 (7nm) and 2022 Qualcomm’s S8G1 built on Samsung’s 4LPX (4nm) process. The performance and power consumption of the Arm A510 cores are effectively on par with each other despite the process technology gap,
indicating SMIC N+2 (7nm) is better than most in the west realize. Part of the reason these chips are so close to each other is Samsung’s poor yield and SMIC’s good yield.
Put simply, Kirin 9000S is a better designed chip than the West realizes. It has solid power and performance. Even with the lackluster export controls, this is a leading edge chip that would be near the front of the pack in 2021, yet was done with no access to EUV, no access to cutting edge US IP, and intentionally hampered. We cannot overstate how scary this is.
P.S. SemiAnalysis expertise (el. microscope forensic) do not include a little secret "Magic Bullet" in 9000S, a HyperTreading option of overall boost of ~25% (a 50% cpu boost with use of only 20% more power) & amazing multitasking.
That "Magic Bullet" brings 9000S on par with SD8gen2 in certain circumstances. But, that option needs to be included in the OS engine and in app, to show full use.
It was included, for expl. in the game Honor of Kings, and result is on par with SD8gen2.
CPU Throttling Test - 23 Ultra SD8gen2 - 15 min / 100 threads - 269.000 GiPS
If the CPU Throttling Test app have a Hyper-Threading enabling option, 9000S wil have 4 CPUs more, and result will be 30 - 50% better!
CPU Throttling Test - S24 Ultra & X7 Ultra SD8gen3 - 60 min / 100 threads - 389.000 GiPS & 360.000 GiPS
Moreover, SD8sGen3 - 290.000 & SD8gen2 with same result, Xiaomi Civi 4 Pro & OnePlus 12r link
* Release date of 9000S is aug. 2023.
No1 in may 2023 SD8gen2
No1 in jan. 2023 SD8gen2
No1 in jan. 2022 SD8gen1
** All of that, with a DUV 7nm, is insane bravura of engineering, SoC performance on par with EUV 4nm, are really scary & as SemiAnalysis also said, it shows an excellent yield rate.
*** The final cost of SoC is only ~20% more then the EUV production, note, lithography part is only a 30% of overall cost of the final SoC.
Consume power per one pass: DUV - 300W, EUV - 500W, NX-EUV - 1KW.
🏆 Unofficial score of 9000S with HyperThreading & GPU included:
[Appendix]
TechanaLye, a Japanese reverse engineering company, estimated SMIC to be 3 years behind TSMC in technology advancement, after comparing Huawei's Kirin 9010 (SMIC 7nm) with its Kirin 9000 (5nm TSMC). The area of SMIC's 7nm mass-produced chip is 118.4 square millimeters, while TSMC's 5nm chip is 107.8 square millimeters; less than 10% area difference, but the processing performance is basically the same.
SMIC uses a 7nm process to achieve the same performance as TSMC’s 5nm process has a huge impact. link link
TSMC 5nm Kirin 9000 vs. SMIC 7nm Kirin 9010 (el. microscope)
The everyone are stunning that SMIC was able to even release a 7nm chip, but to be that good as TSMC 5 nm performance is speechless ! They're even on par with SD8gen2 4nm S23 Ultra, unbelievable !
7nm vs 5nm perfomance
Extra: DUV takes around 34 steps in processing whereas, EUV completes the chip fabrication in just 9 steps. It has a light wavelength of 13.5nm which is 14 times less than DUV. With outdated equipment, it is difficult to achieve next-level chip performance.
After SAQP patent, (3nm), Huawei & SMEE (Shanghai Micro Electronics Equipment) filed a new EUV patent. It is entitled “extreme ultraviolet [EUV] radiation generators and lithography equipment”.
In awaiting of ..
[Edit] 22.08.2224. & 02.09.'24.
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